Super Talent Technology (San Jose, CA) announces a new line of Green-line series lower-power consumption DDR3 memory modules for severs.

These new eco-friendly modules feature lower operating voltages, lightweight and smaller form factors which improve cooling while continuing to satisfy the latest JEDEC standards. Super Talent engineers worked to reduced product height and succeeded with modules that measure 0.72 inches high; a full 39% reduction from a standard size module, yet can deliver speeds at 1600MHz and at 4GB capacities. The short form factor lets the system to run cooler by affording airflow across other components. These design also reduces the Voltage requirements a full 10%, from the traditional 1.5V traditional voltage to the new 1.35 volt standard.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the availability of JESD216: Serial Flash Discoverable Parameters (SFDP) for Serial NOR Flash. Widely anticipated by software engineers, the SFDP will allow Serial Flash manufacturers to embed a standard description of important device characteristics inside the Flash chip.

Users can read the description and obtain critical information about the functional characteristics and capabilities of SFDP compliant Flash memory devices, which will enable user applications such as mobile phones, set-top boxes, HDTVs, PC/NB motherboards, or any system that needs to support multiple Serial NOR Flash device types, to configure themselves to handle various Serial Flash implementations.

Active Media Products, a leading manufacturer of small form factor SSDs and DOMs, today announced a new line of SaberTooth M1 mini SATA (mSATA) SSD drives for notebook upgrades that deliver transfer speeds up to 160 MB/sec, write speeds of up to 80 MB/sec, and are fully compliant with the JEDEC MO-300B mSATA specification.

mSATA is a new JEDEC standard for small form factor SSDs based on the ubiquitous SATA-II, 3Gbps interface. Measuring only 2.0 x 1.2 inches (51 x 30 mm) mSATA SSDs are extremely small and lightweight. This very small and low cost package is perfectly suited for netbooks, notebooks and other ultra mobile computing devices. mSATA drives use an existing mini PCIe connector, but with a modified SATA pinout.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced selected key attributes of its widely-anticipated DDR4 (Double Data Rate 4) standard. With publication forecasted for mid-2012, JEDEC DDR4 will represent a significant advancement in performance with reduced power usage as compared to previous generation technologies. When published, the new standard will be available for free download at www.jedec.org.

DDR4 is being developed with a range of innovative features designed to enable high speed operation and broad applicability in a variety of applications including servers, laptops, desktop PCs and consumer products. Its speed, voltage and architecture are all being defined with the goal of simplifying migration and facilitating adoption of the standard.
A DDR4 voltage roadmap has been proposed that will facilitate customer migration by holding VDDQ constant at 1.2V and allowing for a future reduction in the VDD supply voltage. Understanding that enhancements in technology will occur over time, DDR4 will help protect against technology obsolescence by keeping the I/O voltage stable.

JEDEC Solid State Technology Association and the ESD Association today announced the publication of ANSI/ESDA/JEDEC JS-001-2011 for Electrostatic Discharge Sensitivity (ESD) Testing - Human Body Model (HBM) - Component Level. The product of a ESDA /JEDEC agreement to produce joint standards in the field of device ESD sensitivity testing, the new revision represents a significant update over the prior version of the standard. ANSI/ESDA/JEDEC JS-001-2011 may be downloaded free of charge at www.ESDA.org or www.JEDEC.org.

The primary changes are described in a new pin combination table (Table 2A). The older set of combinations are still permitted and summarized in Table 2B. An expanded annex provides further guidance to allow the user to minimize the interaction between the HBM tester parasitics and the device under tests. This will allow for more accurate HBM tests.

At first glance, one would have discarded the news as some company's attempt to use the AMD brand to sell memory modules, but it is indeed AMD selling memory. AMD is selling Radeon-branded DDR3 memory modules to the consumer market, not just OEMs, which were spotted in stores in Japan. AMD is selling certified DDR3 memory in three segments: Entertainment, UltraPro Gaming, and Enterprise. Entertainment deals with DDR3-1333 MHz modules that are best suited for home and business client PCs, UltraPro Gaming deals with DDR3-1600 MHz modules suited for gaming PCs of all shapes and sizes, while Enterprise deals with registered un-buffered DDR3 memory for use in AMD Opteron-driven servers and workstations.

While baffling, the move to sell its own-branded memory makes some sense. High performance DDR3 memory kits sold in the market today that operate at DDR3-1600 rely on Intel eXtreme Memory Profiles (XMP), a proprietary SPD extension by Intel to let users set the marketed speeds easily. AMD platform motherboards don't support XMP, leaving it at an obvious disadvantage. Radeon-branded memory use JEDEC profiles for 1600 MHz, along with certified timings and voltages to run stable and perform optimally. It might also be using AMD's own SPD extension called "Black Edition profiles", but CPU-Z doesn't seem to be able to spot that. Pictured below is the Entertainment 2 GB module, which uses AMD-branded memory chips. In Japan, the 2 GB module is priced at the equivalent of US $20. Other pricing information is unknown for the moment.UPDATE (11/8): We contacted AMD to talk a little bit about these new memory products that surfaced literally out of nowhere. AMD told us that these are channel products, and as such they don't plan to sell it in a big way on the retail market:

AMD does not manufacture memory and does not plan to sell system memory directly to our customers. AMD is currently determining if the sale of AMD Radeon-branded memory through channel partners is a viable opportunity and as such it has appeared in some regions for purchase through retail.

Toshiba America Electronic Components, Inc. (TAEC) today announced that it has enhanced its NAND flash portfolio with the introduction of a family of higher performance 24-nanometer (nm) e-MMC devices. Greatly reducing the bottlenecks often encountered by single data rate NAND, the use of toggle-mode double data rate (DDR) NAND improves performance and enables faster random access and sequential performance. With densities ranging from 2-gigabyte (GB) to 128GB, these new embedded NAND flash memory modules feature the world's smallest geometry e-MMC, one of the highest capacities achieved in the industry, and offer full compliance with the JEDEC e-MMC Version 4.41 standard.

Toshiba's 24nm e-MMC process lowers costs, enables higher densities, boosts performance and allows for smaller packages - all of which are key requirements for space-conscious applications such as smartphones, tablet PC s, eBooks, digital video cameras, printers, servers, and POS systems.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, announced its latest product offering aimed at satisfying the needs of extreme gamers. In an industry first, the company has launched the single 8GB XPG Gaming Series DDR3L 1333G Desktop overclocking memory. With a high density of 8GB and low voltage of only 1.35V, it is anticipated to provide excellent system performance and overclocking capabilities to meet the requirements of power users and overclockers.

ADATA DRAM product planning department project manager Alex Wu explained, "With the popularity of 64-bit operating systems, high-density memory is a prerequisite in many gamers' minds. We are the first to launch DDR3L 1333G high-density 8GB memory modules, achieved in the XPG Gaming Series". He further stated: "This product adopts a 1.35 volt design, to offer gamers excellent stability and efficiency and also reduce waste heat and power consumption costs". The XPG Gaming Series DDR3L 1333G desktop overclocking memory features high density and low voltage, helping gamers achieve the ultimate in system effectiveness. At the same time, the reduced power consumption leads to lower carbon emissions, resulting in greater environmental sustainability.

TEAM Group, of the TEAM Xtreem fame, showed us its latest generation of ultra-high end DDR3 memory modules for overclocking. The theme for this year is LV (low-voltage) modules, which can do their rated DRAM speeds at 1.35V voltage. We begin with TEAM Xtreem DDR3-2400 MHz and TEAM Xtreem DDR3-2000 MHz, which come in 2 GB and 4 GB module capacities, and in triple-channel and dual-channel kits. These kits are the top of the line that TEAM has, to offer.

Moving on, there's a second line of memory kits for the performance segment, also LV (low-voltage, 1.35V), called TEAM Xtreem Dark series, which offer speeds of DDR3-1600 MHz, and use slightly smaller heatsinks. These modules come in 2, 4 GB capacities, and in dual and triple channel kits. Next up is the TEAM Green series, that are bare modules without heatsinks, that do JEDEC standard DDR3-1333 MHz and DDR3-1600 MHz at 1.35V, with loose timings. Lastly, there's a performance line of SODIMM modules for Apple Macs, the TEAM Mac SODIMM, which runs at DDR3-1333 and DDR3-1066 MHz speeds, offering 2 GB and 4 GB module capacities.

After Aexea, it's time to move onto another boutique memory module vendor, WinChip. This Taiwan-based PC memory vendor seems to focus on the form and design of the memory module (particularly the heatspreaders or heatsinks), so much so, that some of its modules even bear artistic true-color paintings. The first set of modules we came across used a unique kind of heatsinks. Among these, the first one reminded us of some of Mushkin's early heatspreader designs. The second one looks more unique, with a central portion of the heatsink protruding out. A heat pipe is running along the length of the module, evenly distributing heat. In another part of the exhibit, there's a module with a strange heatspreader design. The heatspreader increases module height by almost double, and has a few horizontal grooves to dissipate heat.

Moving on, there are a couple of normally-sized DDR2-800 and DDR3-1333 modules that bears branding of Avatar: The Game. Next up, are the modules attracting a lot of attention. These ones have heatspreaders with fancy true-color graphics, some are photographs, while the others are 3D art, mostly wild-animal themed, including the African Savannah, a gliding eagle, dolphins, toco toucans in a tropical jungle with banana trees, etc.,etc. The last set has heatspreaders with abstract writings in Asian scripts. Like Aexea, WinChip's modules are sold more on their product design. The modules themselves are mostly JEDEC-specced, with the exception of some heavier ones that run at PC3-12800 speeds.

Facing global changes in the memory storage products industry, despite the technical threshold of industrial class and military class memory products are higher; they have the advantages of steadier market demand and supply when compared with their consumer class counterparts. As a result, products of industrial and military applications have become a very competitive field for major module manufacturers. Team Group Inc. has been actively cultivating industrial class products, taking advantage of its strong research and development abilities and its keen grasp of market trends.

Using IFM (Industrial Flash Module) SATA SSD as a pioneer, Team Group Inc. is committed to increasing the performance of integrated system products, and will further move towards to the more stringent industrial specifications in the future. Team Group Inc. aims to provide integrated solutions of more competitive embedded platforms and storage devices for telecommunication, transportation, automation and tablet system developers.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced the new HyperX Plug and Play (PnP) series of high-performance enthusiast memory. HyperX PnP are the first modules to scale the higher memory heights that are a part of the second generation Intel Core i5 and i7 CPUs. The memory is programmed with faster frequencies and when 'plugged' into a system using the Sandy Bridge chipset, will automatically 'play' at either 1600MHz or 1866MHz in both desktop and notebook PCs.

The modules are programmed using JEDEC-compliant settings, allowing 1600MHz and 1866MHz frequency support. It is as simple as plugging in the memory and turning on the machine, as the system automatically recognizes faster memory speed with no further BIOS settings required. Users will notice performance gains as overclocking is automatic with the HyperX Plug and Play modules. In addition, the modules are backwards compatible with previously released DDR3 systems on the market.

Hynix Semiconductor Inc. ('Hynix') today announced that it has developed 2Gb(Gigabit) DDR4 DRAM and DDR4 DRAM based 2GB(Gigabyte) ECC-SODIMM(Error Check & Correction Small Outline Dual In-line Memory Module) applying its leading 30nm class process technology. The DDR4 DRAM product meets the JEDEC standard and the module product is designed for the micro server.

DDR4 DRAM is a next generation memory product which consumes less electronic power while it transfers data as twice as faster than the existing DDR3 DRAM. The device works at the industry's fastest speed of 2400Mbps(Megabits per second), which is also 80% faster than DDR3 1333Mbps product. The Module product operates at such a low voltage of 1.2V and processes up to 19.2 GB (Gigabytes) of data per second with a 64-bit I/O.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced a new mSATA interface SSD that conforms to new JEDEC MO-300V standard.

SSDs are fast, reliable, non-volatile storage devices used in a variety of portable devices. The recent proliferation of netbook and tablet designs has created the need for a standard to enable easy and efficient integration possibilities. The mSATA JEDEC standard MO-300B is one such standard. It is a SATAII interface SSD using a mini PCIe formfactor.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its next-generation storage system standard, Universal Flash Storage (UFS). UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers.

The UFS standard represents an evolutionary progression of JEDEC standards in this field, and has been specifically tailored for mobile applications and computing systems requiring high performance and low power consumption. The initial data throughput for UFS will be 300 megabytes per second (MB/s), and the standard also supports command queuing features to raise random read/write speeds. JESD220 Universal Flash Storage may be downloaded free of charge from the JEDEC website here.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-45 Committee for DRAM Modules intends to form a new Subcommittee focused on the standardisation of hybrid memory modules. To be chaired by PNY Technologies, Inc. and Cypress Semiconductor, the JC-45.6 Hybrid Modules Subcommittee will hold its first meeting in Munich, Germany on February 28, 2011.

Hybrid memory modules are comprised of different types of memory technologies and leverage some of the beneficial characteristics of each, operating as a system instead of as individual components. "I am optimistic about the potential benefits of hybrid modules," said Chris Socci, Chairman of the new JC-45.6 Subcommittee. "For example, modules with a DRAM interface that also incorporate the non-volatile characteristics of NAND flash could provide new options for data security in a variety of storage and backup systems in the event of power loss. This new family of modules has the potential to help entire segments of the market 'go green' by reducing the need for batteries, and may one day extend to all applications that demand memory."

German memory maker Exceleram released five new Rippler series dual-channel DDR3 memory kits brandishing optimal support for Intel's Sandy Bridge architecture processors. The fleet consists of 2x 2 GB and 2x 4 GB pairs, carrying SPD/XMP profiles of 1333 MHz or 1600 MHz. It starts with ERS300A, which is a 2x 2 GB kit that does 1333 MHz with 9-9-9-24 timings, strictly adhering to the JEDEC PC3-10700H specification. Next is the ERS301A, which is a 2x 4 GB kit that also sticks to the JEDEC specification, doing 1333 MHz @ 9-9-9-24.

Things become faster with ERS302A, which is a 2x 2 GB kit carrying XMP-1600 profile, doing 1600 MHz at 9-9-9-24. The ERS303A is a 2x 4 GB version of the same. Lastly, there's ERS304A, which carries an XMP profile that runs the modules at 1333 MHz, albeit with 7-10-10-24, with CAS taking a kit on every other vital latency parameter. All kits carry module voltages specified in the profiles at 1.50 volts. All modules feature black PCBs and the Rippler heatspreader the company used in several models, in the past. Exceleram did not give out pricing information.

Upgrade your laptop or desktop with some of the best high density memory modules on the market thanks to PNY's new DIMM DDR3 4GB 1333MHz and SODIMM DDR3 4GB 1066 MHz. Raising the bar for mid-range modules, PNY ensures that your PC's memory is given a proper boost and its performance is improved. Exceptionally fast, these 4GB components are also new to the PNY memory range.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced that its JC-64.8 Subcommittee for Solid State Drives will target the development of standards for SSDs in applications beyond conventional disk drive form factors. Building on JEDEC's leadership in the development of standards for solid state drives and the success of recently published SSD standards JESD218 and JESD219, the interest in standardizing SSDs for non-traditional applications is being driven by rising demand for smaller consumer electronics devices.

"Momentum for adoption of embedded SSDs continues to grow and with the right OEM support, Gartner believes that embedded SSDs could potentially out ship traditional SSD form factor usage in mobile PCs by 2013," according to Joseph Unsworth, Research Director at Gartner.

Samsung Electronics Co., Ltd, a global leader in advanced semiconductor technology solutions, announced today that it completed development of the industry's first DDR4 DRAM module last month, using 30 nanometer (nm) class process technology.

"Samsung has been actively supporting the IT industry with our green memory initiative by coming up with eco-friendly, innovative memory products providing higher performance and power efficiency every year," said Dong Soo Jun, president, memory division, Samsung Electronics. "The new DDR4 DRAM will build even greater confidence in our cutting-edge green memory, particularly when we introduce four-gigabit (Gb) DDR4-based products using next generation process technology for mainstream application."

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced that it is moving towards publication of the next-generation flash memory standard, Universal Flash Storage (UFS). Major progress achieved at recent JEDEC committee meetings provides visibility on the anticipated UFS interface, which has been designed to be the most advanced specification for flash memory-based storage in mobile devices such as smart phones and tablet computers. Developed to help address the ever-increasing demand for improved device performance, UFS has been designed to initially enable data throughput of 300 megabytes per second (MB/s), and support command queuing features to raise the random read/write speeds. The standard will be finalized for public use within the next three months.

An explosion of data-intensive applications for mobile devices is driving the need for versatile storage solutions, and currently available flash storage options might not have the span to match overall system performance planned for future generation platforms. UFS will provide a dramatic change in architecture to increase performance while maintaining the benefits of low power consumption offered by existing solutions such as e•MMC.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Xtreme Thermal Exchange (XTE) and Blade 2 high-speed desktop memory, providing the optimal balance of blazing DDR3 performance and cooling efficiency in one solution. Committed to staying ahead of the curve in the high performance segment of the memory market, OCZ is offering high-end memory that keeps pace with intensive overclocking, gaming, and other high-productivity computing environments.

"Building on our previous lines of enthusiast overclocking memory, the new XTE and Blade 2 DDR3 memory series are designed to set the benchmark once again and deliver the ultimate in performance and stability," said Alex Mei, CMO of OCZ Technology Group. "Featuring new compact, yet highly efficient heatspreader designs, these hand-tested kits are the ideal solution for overclockers gaming and productivity applications, and are optimized for the latest generation of platforms from Intel and AMD."

Viking Modular Solutions, a division of Sanmina-SCI Corporation (Nasdaq: SANM), and leading manufacturer of innovative DRAM modules and Solid State Drive (SSD) solutions, today announced its DDR3 8GB Very Low Profile (VLP) Registered DIMM is available for immediate qualification. Suitable for the most demanding environmental conditions, this high-density VLP RDIMM is optimal for Original Equipment Manufacturer (OEM) customers in the telecommunications, enterprise, cloud and embedded computing markets that need the benefit of high density in a very low profile form factor.

Viking Modular is a leader in creating innovative DRAM packaging solutions that offer excellent signal integrity and thermal management. This latest DDR3 8GB VLP RDIMM uses mainstream 2Gbit DDR3 DRAM to deliver a cost effective, reliable, high-density solution, ideally suited for blade servers, storage bridge bay (SBB), AdvancedTCA (ATCA) and multiple space constrained high performance computing environments.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it had begun sample shipments of its new 32-gigabyte Load Reduced Dual In-Line Memory Module (LRDIMM), the DRAM industry's highest density memory module. The LRDIMM consists of 72 advanced 40nm process 4-gigabit DDR3 SDRAMs in a Double Density Package (DDP).

LRDIMM is a new standard for server memory modules that reduces I/O bus capacity by buffering the I/O bus line with the memory buffer (MB) to simultaneously enable higher system density and faster speed. JEDEC, a standardization body for the semiconductor industry, is studying the adoption of LRDIMM standards. Elpida is actively engaged in promoting its own standard.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced they've begun shipping their new 8GB Registered-ECC DDR3 DRAM modules to support low-voltage Intel Westmere platforms. Our JEDEC standard 1.35V DDR3 ECC/R-DIMM 8GB module running at 1333MHz with latencies of 9-9-9.

Reducing the costs associated with the Enterprise Data Center has become an important goal for the Enterprise server market. Our DDR3 memory product runs at 1.35v instead of the traditional 1.5v. The lower operating voltage reduces memory power consumption by over 20%, in comparison with the standard 1.5V DDR3 memory modules, and translates directly into lower power, less cooling, lower electrical bills, and less CO2 emissions for the data center.